Process capability
| Item | Capability |
|---|---|
| Layer count | 2-16 (Layers) |
| Max. shipping size | 19.68" × 23.6" (500 × 600 mm) |
| Finished board thickness | 0.4 mm ~ 2.4 mm |
| Min. inner core thickness | 1/1 3 mil |
| Material type | Normal-Tg, M-Tg, H-Tg, HF |
| Base copper (inner) | H ~ 2 oz |
| Base copper (outer) | H ~ 2 oz |
| Inner min. line / space | H/H oz : 3 mil / 3 mil 1/1 oz : 3 mil / 3 mil 2/2 oz : 3 mil / 4.5 mil |
| Item | Capability |
|---|---|
| Outer min. line / space | H/H oz : 3 mil / 3 mil 1/1 oz : 3 mil / 3.5 mil 2/2 oz : 3 mil / 4.5 mil |
| Min. SMD pitch | 8 mil |
| Min. finished / drilled hole | 6 mil / 0.2 mm |
| Hole size tolerance | PTH: ±3 mil, NPTH: ±2 mil |
| Hole position accuracy | ±3 mil |
| Plating aspect ratio | 12:1 |
| Impedance control | ≤ 50 Ω, ±5 Ω ; > 50 Ω, ±10% |
| Surface finish | Lead free: OSP / ENIG / Immersion Ag / HASL, etc. |
| L | 8 L | 10L | 12L | 14L | 16L |
|---|---|---|---|---|---|
| Cross-section |  |  |  |  |  |